Koh Young KY8030-3
Koh Young KY8030-3 3D SPI, 10 um resolution, PCB 510x460 mm, 60 cm2/s inspection speed, 4-phase moire, for SMT solder paste inspection.
High-resolution 3D SPI with 10 um accuracy for precise solder paste inspection.
Large PCB capacity of 510x460 mm supports diverse industrial applications.
Fast inspection speed of 60 cm2/s ensures efficient production line operation.
| Type | 3D SPI (Solder Paste Inspection) |
| PCB size | up to 510 x 460 mm |
| Resolution | 10 um |
| Inspection speed | up to 60 cm2/s |
| Moiré technology | 4-phase moiré |